Features & Benefits
- High-performance, non-curing silicone gel formula for exceptional thermal conductivity.
- Conforms to varying gap heights, ensuring reliable contact for optimal cooling.
- Minimal bond line thickness (0.2mm) reduces thermal resistance for enhanced heat dissipation.
- Protects sensitive components from mechanical stress during installation and operation.
- Perfect processing consistency guarantees stability and effective compensation for surface unevenness.
- Ideal for use with memory, VRM, and other heat-generating electronics.